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product data sheet product brief description key applications features and benefits www.seoulsemicon.com 1 ???? ? ????? ???? ???? ?? : ?? ?? ??? ?? ?? ? ???? ? ? ?? ? ???? : ??? ?? ?? ?? 5cm ?? ?? ?? ??? ?? ( ???? ?? ?? ) ? key message: - ex) enabling high flux systems while reduces led count - ex) enabling compact systems with high reliability - ex) high reliability and high quality of light - ex) flicker - free ac/dc led solution - ex) high - efficient dimming solution ? product family: - ex) mid - power led - ex) high - power led for automotive - ex) chip on board ? product id (part number): - ex) stw8c2sa - ex) sz5 - m0 - wn - c8 ? description ? ? features and benefits ? ? key applications ? ? ?? ??? table ?? #. ? ?? ? ???? ?? . certificate ??? ?? ( ???? ??? ??? ?? ?????? ?? ?? ) font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt rev1,2, apr 1, 2016 smjd - xd12w4px - acrich3 12.8w integrated ac led solution smjd - xd12w4px acrich3 C 12.8w ? the acrich3 series of products are designed to be driven directly off of ac line voltage, therefore they do not need the standard converter essential for conventional general lighting products. ? the converter or driver found in most general lighting products can limit the overall life of the product, but with the acrich3 series of products the life of the product can more closely be estimated from the led itself. this will also allow for a much smaller form factor from an overall fixture design allowing for higher creativity in the fixture. ? the modules have a high power factor which can contribute to a higher energy savings in the end application. table 1. product selection (cct) rohs tv, pc, nb, mnt, mobile automotive lighting, mr16, par, down light bulb, lft outdoor, streetlight, tunnel, parking home appliance architectural, entertainment sign, channel sensor, torch application ???? ??? ?? ( ?? ???? ????? ?? ?? ) troffer, highbay rohs lm - 80 macadam 3 - step ? down l light ? connects directly to ac line voltage ? high power efficiency & factor ? low thd ? long life time ? simple bom ? miniaturization ? lead free product ? rohs compliant ? triac dimming table 2. product selection (flux) part no. vin [vac] p [w] color cct [k] cri min. smjd - 2d12w4pd smjd - 3d12w4pd 120 220 12.8 cool 4700 C 6000 80 neutral 3700 C 4200 smjd - 2d12w4pe smjd - 3d12w4pe 120 220 90 warm 2600 - 3200 part no. vin [vac] p [w] flux [lm] remark min. typ. smjd - 2d12w4pd smjd - 3d12w4pd 120 220 12.8 1100 1200 12a 1200 1350 12b 1350 1450 12c smjd - 2d12w4pe smjd - 3d12w4pe 120 220 12.8 1000 1100 12a
www.seoulsemicon.com product data sheet 2 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led table of contents index ? product brief 1 ? table of contents 2 ? performance characteristics 3 ? thermal resistance 5 ? characteristics graph 6 ? color bin structure 11 ? mechanical dimensions 17 ? marking information 19 ? packing information 20 ? label information 21 ? handling of silicone resin for leds 22 ? precaution for use 23 ? company information 25
www.seoulsemicon.com product data sheet 3 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 performance characteristics unit ? ????? ?? table 3. electro optical characteristics, t a = 25oc parameter symbol value unit mark min. typ. max. luminous flux (@cri.80) v [2] 1100 1200 - lm 12a 1200 1350 - 12b 1350 1450 - 12c luminous flux (@cri.90) 1000 1100 - 12a correlated color temperature [3] cct 5300 5600 6000 k b 4700 5000 5300 c 3700 4000 4200 e 2900 3000 3200 g 2600 2700 2900 h cri ra 80 - - - pd 90 - - - pe input voltage [4] v in 120 vac 2d 220 3d power consumption p 11.5 12.8 14.1 w 12w operating frequency f 50 / 60 hz power factor pf over 0.97 - viewing angle 2 1/2 120 deg. tolerance of surge [5] v s 500 - - v transient protection [6] v s 2500 - - v notes : (1) at 120/220vac , t a = 25oc (2) v is the total luminous flux output measured with an integrated sphere. (3) correlated color temperature is derived from the cie 1931 chromaticity diagram. (4) operating voltage doesn't indicate the maximum voltage which customers use but means tolerable voltage according to each countrys voltage variation rate. it is recommended that the solder pad temperature should be below 70 . (5) surge withstand in accordance with iec61000 - 4 - 5 (6) at 120vac, seven strikes, 100khz 2.5kv in accordance with ansi/ieee c62.41.2 - 2002 category a operation
www.seoulsemicon.com product data sheet 4 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 performance characteristics unit ? ????? ?? table 4. absolute maximum ratings, t a = 25oc parameter symbol unit value maximum input voltage @120vac v in vac 144 maximum input voltage @220vac 264 power consumption p w 16.5 operating temperature t opr oc - 30 ~ 85 storage temperature t stg oc - 40 ~ 100 esd sensitivity - - 4,000v hbm
www.seoulsemicon.com product data sheet 5 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 thermal resistance the acrich3 module is recommended to keep the junction temperature under maximum junction temperature spec. (table 5) led lead temperature and ic top case temperature are measured with thermocupler. (fig1) led & ic juntion temperatures can be calculated using the formulas below. t s_max = t j_max - (r j - s * p d ) < example > if led lead temperature and ic top temerature are 110 1) led juntion temperature t j = t s + (r j - s * p d ) = 110 + (9 /w * 0.84w) = 117.56 2) ic junction temperature t j = t s + (r j - s * p d ) (1) = 110 + (11.25 /w * 2.8w) = 141.5 * (1) : in the example, p d value is the power consumption of ic when the rated voltage. part maximum junction temperature [ ] r j - s [ /w] acrich3 led 125 9 acrich3 ic 150 11.25 notes : table 5. thermal information, ta = 25oc
www.seoulsemicon.com product data sheet 6 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 characteristics graph product data sheet ? ?? ???? ??? x ? / y ?? ??? . fig 1. relative spectral distribution vs. wavelength characteristic C g, h fig 2 . relative spectral distribution vs. wavelength characteristic C e 0 0.2 0.4 0.6 0.8 1 1.2 300 400 500 600 700 800 relative spectral power distribution wavelength[nm] relative spectral power distribution at ta=25oc 0 0.2 0.4 0.6 0.8 1 1.2 300 400 500 600 700 800 relative spectral power distribution wavelength[nm] relative spectral power distribution at ta=25oc
www.seoulsemicon.com product data sheet 7 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 characteristics graph product data sheet ? ?? ???? ??? x ? / y ?? ??? . fig 3. relative spectral distribution vs. wavelength characteristic C b, c 0 0.2 0.4 0.6 0.8 1 1.2 300 400 500 600 700 800 relative spectral power distribution wavelength[nm] relative spectral power distribution at ta=25oc
www.seoulsemicon.com product data sheet 8 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 characteristics graph product data sheet ? ?? ???? ??? x ? / y ?? ??? . fig 5. relative power distribution vs. voltage at t a =25 , 220v fig 4. relative power distribution vs. voltage at t a =25 , 120v
www.seoulsemicon.com product data sheet 9 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 characteristics graph product data sheet ? ?? ???? ??? x ? / y ?? ??? . fig 6. relative luminous flux vs. voltage at t a = 25 , 220v fig 7. relative luminous flux vs. voltage at t a =25 , 220v
www.seoulsemicon.com product data sheet 10 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 characteristics graph product data sheet ? ?? ???? ??? x ? / y ?? ??? . fig 8. radiant pattern, t a = 25
www.seoulsemicon.com product data sheet 11 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 color bin structure ? color bin cie ???? ? ?? ??? . bin x y bin x y bin x y bm 0.3266 0.3428 cm 0.3427 0.3568 em 0.3806 0.3822 0.3268 0.3371 0.3423 0.3504 0.3786 0.3745 0.3319 0.3416 0.3476 0.3547 0.3846 0.3782 0.3319 0.3476 0.3482 0.3613 0.3870 0.3861 gm 0.4336 0.4067 hm 0.4581 0.4143 0.4294 0.3977 0.4531 0.4051 0.4354 0.3999 0.4589 0.4065 0.4398 0.4089 0.4641 0.4157 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 3700k 4200k 4700k h e g c b 5300k 2900k 2600k 3200k 6000k y x ansi macadam 3-step
www.seoulsemicon.com product data sheet 12 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 color bin structure ? color bin cie ???? ? ?? ??? . bin x y bin x y bin x y bin x y b11 0.3207 0.3462 b21 0.3250 0.3501 b31 0.3292 0.3539 b41 0.3334 0.3578 0.3211 0.3407 0.3252 0.3444 0.3293 0.3481 0.3333 0.3518 0.3252 0.3444 0.3293 0.3481 0.3333 0.3518 0.3374 0.3554 0.3250 0.3501 0.3292 0.3539 0.3334 0.3578 0.3376 0.3616 b12 0.3211 0.3407 b22 0.3252 0.3444 b32 0.3293 0.3481 b42 0.3333 0.3518 0.3215 0.3353 0.3254 0.3388 0.3293 0.3423 0.3332 0.3458 0.3254 0.3388 0.3293 0.3423 0.3332 0.3458 0.3371 0.3493 0.3252 0.3444 0.3293 0.3481 0.3333 0.3518 0.3374 0.3554 b13 0.3215 0.3353 b23 0.3254 0.3388 b33 0.3293 0.3423 b43 0.3332 0.3458 0.3218 0.3298 0.3256 0.3331 0.3294 0.3364 0.3331 0.3398 0.3256 0.3331 0.3294 0.3364 0.3331 0.3398 0.3369 0.3431 0.3254 0.3388 0.3293 0.3423 0.3332 0.3458 0.3371 0.3493 b14 0.3218 0.3298 b24 0.3256 0.3331 b34 0.3294 0.3364 b44 0.3331 0.3398 0.3222 0.3243 0.3258 0.3275 0.3294 0.3306 0.3330 0.3338 0.3258 0.3275 0.3294 0.3306 0.3330 0.3338 0.3366 0.3369 0.3256 0.3331 0.3294 0.3364 0.3331 0.3398 0.3369 0.3431 bm 0.320 0.325 0.330 0.335 0.340 0.32 0.33 0.34 0.35 0.36 b44 b43 b42 b41 b34 b33 b32 b31 b24 b23 b22 b21 b14 b13 b12 5600k b11 5300k 6000k y x
www.seoulsemicon.com product data sheet 13 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 color bin structure ? color bin cie ???? ? ?? ??? . bin x y bin x y bin x y bin x y c11 0.3376 0.3616 c21 0.3420 0.3652 c31 0.3463 0.3687 c41 0.3507 0.3724 0.3374 0.3554 0.3415 0.3588 0.3457 0.3622 0.3500 0.3657 0.3415 0.3588 0.3457 0.3622 0.3500 0.3657 0.3542 0.3692 0.3420 0.3652 0.3463 0.3687 0.3507 0.3724 0.3551 0.3760 c12 0.3374 0.3554 c22 0.3415 0.3588 c32 0.3457 0.3622 c42 0.3500 0.3657 0.3371 0.3493 0.3411 0.3525 0.3452 0.3558 0.3492 0.3591 0.3411 0.3525 0.3452 0.3558 0.3492 0.3591 0.3533 0.3624 0.3415 0.3588 0.3457 0.3622 0.3500 0.3657 0.3542 0.3692 c13 0.3371 0.3493 c23 0.3411 0.3525 c33 0.3452 0.3558 c43 0.3492 0.3591 0.3369 0.3431 0.3407 0.3462 0.3446 0.3493 0.3485 0.3524 0.3407 0.3462 0.3446 0.3493 0.3485 0.3524 0.3523 0.3555 0.3411 0.3525 0.3452 0.3558 0.3492 0.3591 0.3533 0.3624 c14 0.3369 0.3431 c24 0.3407 0.3462 c34 0.3446 0.3493 c44 0.3485 0.3524 0.3366 0.3369 0.3403 0.3399 0.3440 0.3428 0.3477 0.3458 0.3403 0.3399 0.3440 0.3428 0.3477 0.3458 0.3514 0.3487 0.3407 0.3462 0.3446 0.3493 0.3485 0.3524 0.3523 0.3555 cm 0.335 0.340 0.345 0.350 0.355 0.33 0.34 0.35 0.36 0.37 0.38 c44 c43 c42 c41 c34 c33 c32 c31 c24 c23 c22 c21 c14 c13 c12 5000k c11 4700k 5300k y x
www.seoulsemicon.com product data sheet 14 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 color bin structure ? color bin cie ???? ? ?? ??? . bin x y bin x y bin x y bin x y e11 0.3736 0.3874 e21 0.3804 0.3917 e31 0.3871 0.3959 e41 0.3939 0.4002 0.3720 0.3800 0.3784 0.3841 0.3849 0.3881 0.3914 0.3922 0.3784 0.3841 0.3849 0.3881 0.3914 0.3922 0.3979 0.3962 0.3804 0.3917 0.3871 0.3959 0.3939 0.4002 0.4006 0.4044 e12 0.3720 0.3800 e22 0.3784 0.3841 e32 0.3849 0.3881 e42 0.3914 0.3922 0.3703 0.3726 0.3765 0.3765 0.3828 0.3803 0.3890 0.3842 0.3765 0.3765 0.3828 0.3803 0.3890 0.3842 0.3952 0.3880 0.3784 0.3841 0.3849 0.3881 0.3914 0.3922 0.3979 0.3962 e13 0.3703 0.3726 e23 0.3765 0.3765 e33 0.3828 0.3803 e43 0.3890 0.3842 0.3687 0.3652 0.3746 0.3689 0.3806 0.3725 0.3865 0.3762 0.3746 0.3689 0.3806 0.3725 0.3865 0.3762 0.3925 0.3798 0.3765 0.3765 0.3828 0.3803 0.3890 0.3842 0.3952 0.3880 e14 0.3687 0.3652 e24 0.3746 0.3689 e34 0.3806 0.3725 e44 0.3865 0.3762 0.3670 0.3578 0.3727 0.3613 0.3784 0.3647 0.3841 0.3682 0.3727 0.3613 0.3784 0.3647 0.3841 0.3682 0.3898 0.3716 0.3746 0.3689 0.3806 0.3725 0.3865 0.3762 0.3925 0.3798 em 0.36 0.37 0.38 0.39 0.40 0.35 0.36 0.37 0.38 0.39 0.40 0.41 e44 e43 e42 e41 e34 e33 e32 e31 e24 e23 e22 e21 e14 e13 e12 4000k e11 3700k 4200k y x
www.seoulsemicon.com product data sheet 15 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 color bin structure ? color bin cie ???? ? ?? ??? . bin x y bin x y bin x y bin x y g11 0.4299 0.4165 g21 0.4364 0.4188 g31 0.4430 0.4212 g41 0.4496 0.4236 0.4261 0.4077 0.4324 0.4099 0.4387 0.4122 0.4451 0.4145 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 0.4514 0.4168 0.4365 0.4189 0.4430 0.4212 0.4496 0.4236 0.4562 0.4260 g12 0.4261 0.4077 g22 0.4324 0.4100 g32 0.4387 0.4122 g42 0.4451 0.4145 0.4223 0.3990 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4468 0.4077 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 0.4515 0.4168 g13 0.4223 0.3990 g23 0.4284 0.4011 g33 0.4345 0.4033 g43 0.4406 0.4055 0.4185 0.3902 0.4243 0.3922 0.4302 0.3943 0.4361 0.3964 0.4243 0.3922 0.4302 0.3943 0.4361 0.3964 0.4420 0.3985 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4468 0.4077 g14 0.4243 0.3922 g24 0.4302 0.3943 g34 0.4302 0.3943 g44 0.4361 0.3964 0.4203 0.3834 0.4259 0.3853 0.4259 0.3853 0.4316 0.3873 0.4147 0.3814 0.4203 0.3834 0.4316 0.3873 0.4373 0.3893 0.4185 0.3902 0.4243 0.3922 0.4361 0.3964 0.4420 0.3985 gm 0.41 0.42 0.43 0.44 0.45 0.46 0.38 0.39 0.40 0.41 0.42 0.43 g44 g43 g42 g41 g34 g33 g32 g31 g24 g23 g22 g21 g14 g13 g12 3000k g11 2900k 3200k y x
www.seoulsemicon.com product data sheet 16 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 color bin structure ? color bin cie ???? ? ?? ??? . bin x y bin x y bin x y bin x y h11 0.4562 0.4260 h21 0.4625 0.4275 h31 0.4687 0.4289 h41 0.4750 0.4304 0.4515 0.4168 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4758 0.4225 0.4625 0.4275 0.4687 0.4289 0.4750 0.4304 0.4810 0.4319 h12 0.4515 0.4168 h22 0.4575 0.4182 h32 0.4636 0.4197 h42 0.4697 0.4211 0.4468 0.4077 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4703 0.4132 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4758 0.4225 h13 0.4468 0.4077 h23 0.4526 0.4090 h33 0.4585 0.4104 h43 0.4644 0.4118 0.4420 0.3985 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4648 0.4038 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4703 0.4132 h14 0.4420 0.3985 h24 0.4477 0.3998 h34 0.4534 0.4012 h44 0.4591 0.4025 0.4373 0.3893 0.4428 0.3906 0.4483 0.3919 0.4538 0.3932 0.4428 0.3906 0.4483 0.3919 0.4538 0.3932 0.4593 0.3944 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4648 0.4038 hm 0.43 0.44 0.45 0.46 0.47 0.48 0.38 0.39 0.40 0.41 0.42 0.43 0.44 h44 h43 h42 h41 h34 h33 h32 h31 h24 h23 h22 h21 h14 h13 h12 2700k h11 2600k 2900k y x
www.seoulsemicon.com product data sheet 17 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 mechanical dimensions notes : (1) all dimensions are in millimeters. (tolerance : 0.2) (2) scale : none smjd - 2d12w4pd smjd - 2d12w4pe
www.seoulsemicon.com product data sheet 18 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 mechanical dimensions notes : (1) all dimensions are in millimeters. (tolerance : 0.2) (2) scale : none smjd - 3d12w4pd smjd - 3d12w4pe
www.seoulsemicon.com product data sheet 19 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 marking information a a : marking cri module flux bin cct vf bin mark cri type mark min. typ. mark bin a bin b mark min. max. d 80 a 88 1000 1100 * 0 *22 * 33 1 d1 d1 e 90 99 * 1 * 23 * 32 2 d1 d2 11 1100 1200 * 2 * 33 * 22 3 d2 d1 b 33 1200 1350 * 3 * 32 * 23 4 d1 d3 55 * 4 *mc *mc 5 d3 d1 c 77 1350 1450 * 5 * 22 * 22 6 d2 d2 * 6 * 23 * 23 7 d2 d3 * 7 * 32 * 32 8 d3 d2 * 8 * 33 * 33 9 d3 d3 * 9 * 22 * 34 *a * 22 * 43 *b * 22 * 44 *c * 23 * 31 *d * 23 * 41 *e * 23 * 42 *f * 32 * 13 *g * 32 * 14 *h * 32 * 24 *i * 33 * 11 *j * 33 * 12 *k * 33 * 21 * cct mark from *0 to *4 is 3 - step ex) 150101 db33g11 - description a : 1 5 0 1 0 1 d b 3 3 g 1 1 smt date (yymmdd, 6 digits) cri (1 digits) module flux bin (3 digits) cct (1 digit) cct combination no. (1 digit) vf combination no. (1 digit)
www.seoulsemicon.com product data sheet 20 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 packing 1. tray information 2. tray stack and taping ? 10 led module trays and additional 1 dummy trays each up and down of box ? add silica gel ( 1ea ) on top of the tray 3. sealing packing dielectric sealing pack ( 700x700) 4. box information & packing ? 20 pcs led modules packed per tray 32ea trays with led modules ? 320 pcs modules per box 1ea ** 1 box : 32 pcs per tray x 10 trays = 320 pcs ? box size : 590 x 330 x 165 mm
www.seoulsemicon.com product data sheet 21 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 label information notes (1) it is attached to the bottom right corner of the box. notes (1 ) the model number designation is explained as follow smjd : seoul semiconductor internal code xd : input voltage (2d = 120v, 3d = 220v) 12w : about power consumption 4 : acrich ic version 3.0 px: mjt pkg (d=saw8c72a, e=saw9c72a) (2) it represents module optical spec. luminous flux : 12a, 12b, 12c cct : h~b cri : 80 or 90 cie area : 3 or 4(3step or 4step) (3) it represents module cie spec cie area : 3step or 4step (4) it is attached to the top of a sealing pack & the bottom right corner of the box. model no. smjd - xd12w4px (1) iiiii ii iiiii iii rank 12bg803 (2) iiiii ii iiiii iii type 3 - step (3) quantity xx iiiii ii iiiii iii date yymddxxxxx - xxxxxxx iiiii ii iiiii iii seoul semiconductor co.,ltd. total quantity xx seoul semiconductor co.,ltd.
www.seoulsemicon.com product data sheet 22 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 handling of silicone resin for leds (1) acrich3 series is encapsulated with silicone resin for high optical efficiency. (2) please do not touch the silicone resin area with sharp objects such as pincette(tweezers). (3) finger prints on silicone resin area may affect the performance. (4) please store leds in covered containers to prevent dust accumulation as this may affect performance. (5) excessive force more than 3000gf to the silicone lens can result in fatal or permanent damage with leds. (6) please do not cover the silicone resin area with any other resins such as epoxy, urethane, etc.
www.seoulsemicon.com product data sheet 23 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 precaution for use ??? ??? ( ) ? ???? ??? . (1) please review the acrich3 application note for proper protective circuitry usage. (2) please note, acrich3 products run off of high voltage, therefore caution should be taken when working near acrich3 products. (3) make sure proper discharge prior to starting work. (4) do not touch any of the circuit board, components or terminals with body or metal while circuit is active. (5) please do not add or change wires while acrich3 circuit is active. (6) long time exposure to sunlight or uv can cause the lens to discolor. (7) please do not use adhesives to attach the led that outgas organic vapor. (8) please do not use together with the materials containing sulfur. (9) please do not assemble in conditions of high moisture and/or oxidizing gas such as cl, h 2 s, nh 3 , so 2 , no x , etc. (10) please do not make any modification on module. (11) please be cautious when soldering to board so as not to create a short between different trace patterns. (12) do not impact or place pressure on this product because even a small amount of pressure can damage the product. the product should also not be placed in high temperatures, high humidity or direct sunlight since the device is sensitive to these conditions. (13) when storing devices for a long period of time before usage, please following these guidelines: * the devices should be stored in the anti - static bag that it was shipped in from seoul - semiconductor with opening. * if the anti - static bag has been opened, re - seal preventing air and moisture from being present in the bag. (14) leds and ic are sensitive to electro - static discharge (esd) and electrical over stress (eos). the acrich3 product should also not be installed in end equipment without esd protection. below is a list of suggestions that seoul semiconductor purposes to minimize these effects. a. esd (electro static discharge) electrostatic discharge (esd) is the defined as the release of static electricity when two objects come into contact. while most esd events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. the damage from esd to an leds may cause the product to demonstrate unusual characteristics such as:
www.seoulsemicon.com product data sheet 24 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 precaution for use ??? ??? ( ) ? ???? ??? . - increase in reverse leakage current lowered turn - on voltage - abnormal emissions from the led at low current the following recommendations are suggested to help minimize the potential for an esd event. one or more recommended work area suggestions: - ionizing fan setup - esd table/shelf mat made of conductive materials - esd safe storage containers one or more personnel suggestion options: - antistatic wrist - strap - antistatic material shoes - antistatic clothes environmental controls: - humidity control (esd gets worse in a dry environment) b. eos (electrical over stress) electrical over - stress (eos) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. the effects from an eos event can be noticed through product performance like: - changes to the performance of the led package (if the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - changes to the light output of the luminaire from component failure - components on the board not operating at determined drive power failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. it is impossible to predict the failure mode of every led exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an eos event has occurred: - damaged may be noticed to the bond wires (appearing similar to a blown fuse) - damage to the bond pads located on the emission surface of the led package (shadowing can be noticed around the bond pads while viewing through a microscope) - anomalies noticed in the encapsulation and phosphor around the bond wires - this damage usually appears due to the thermal stress produced during the eos event c. to help minimize the damage from an eos event seoul semiconductor recommends utilizing: - a surge protection circuit - an appropriately rated over voltage protection device - a current limiting device
www.seoulsemicon.com product data sheet 25 smjd - xd12w4px - acrich3 12.8w rev1,2, apr 1, 2016 company information published by seoul semiconductor ? 2013 all rights reserved. company information seoul semiconductor (www.seoulsemicon.com) manufacturers and packages a wide selection of light emitting diodes (leds) for the automotive, general illumination/lighting, home appliance, signage and back lighting markets. the company is the worlds fifth largest led supplier, holding more than 10,000 patents globally, while offering a wide range of led technology and production capacity in areas such as npola, "acrich", the worlds first commercially produced ac led, and "acrich mjt - multi - junction technology" a proprietary family of high - voltage leds. the companys broad product portfolio includes a wide array of package and device choices such as acrich and acirch2, high - brightness leds, mid - power leds, side - view leds, and through - hole type leds as well as custom modules, displays, and sensors. legal disclaimer information in this document is provided in connection with seoul semiconductor products. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, seoul semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non - infringement of intellectual property rights of any third party. the appearance and specifications of the product can be changed to improve the quality and/or performance without notice.

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